Invention Grant
- Patent Title: Measurement of composition for thin films
- Patent Title (中): 测量薄膜组成
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Application No.: US13524053Application Date: 2012-06-15
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Publication No.: US09442063B2Publication Date: 2016-09-13
- Inventor: Ming Di , Torsten Kaack , Qiang Zhao , Xiang Gao , Leonid Poslavsky
- Applicant: Ming Di , Torsten Kaack , Qiang Zhao , Xiang Gao , Leonid Poslavsky
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/21
- IPC: G01N21/21 ; G01N21/84

Abstract:
The present invention includes generating a three-dimensional design of experiment (DOE) for a plurality of semiconductor wafers, a first dimension of the DOE being a relative amount of a first component of the thin film, a second dimension of the DOE being a relative amount of a second component of the thin film, a third dimension of the DOE being a thickness of the thin film, acquiring a spectrum for each of the wafers, generating a set of optical dispersion data by extracting a real component (n) and an imaginary component (k) of the complex index of refraction for each of the acquired spectrum, identifying one or more systematic features of the set of optical dispersion data; and generating a multi-component Bruggeman effective medium approximation (BEMA) model utilizing the identified one or more systematic features of the set of optical dispersion data.
Public/Granted literature
- US20130006539A1 MEASUREMENT OF COMPOSITION FOR THIN FILMS Public/Granted day:2013-01-03
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