Invention Grant
US09443728B2 Accelerated relaxation of strain-relaxed epitaxial buffers by use of integrated or stand-alone thermal processing
有权
通过使用集成或独立的热处理来加速松弛应变松弛的外延缓冲层
- Patent Title: Accelerated relaxation of strain-relaxed epitaxial buffers by use of integrated or stand-alone thermal processing
- Patent Title (中): 通过使用集成或独立的热处理来加速松弛应变松弛的外延缓冲层
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Application No.: US14461191Application Date: 2014-08-15
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Publication No.: US09443728B2Publication Date: 2016-09-13
- Inventor: Swaminathan T. Srinivasan , Atif M. Noori , David K. Carlson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/324

Abstract:
Implementations of the present disclosure generally relate to methods and apparatus for forming a film on a substrate. More particularly, implementations of the present disclosure relate to methods and apparatus for heteroepitaxial growth of crystalline films. In one implementation, a method of heteroepitaxial deposition of a strain relaxed buffer (SRB) layer on a substrate is provided. The method comprises epitaxially depositing a buffer layer over a dissimilar substrate, rapidly heating the buffer layer to relax the buffer layer, rapidly cooling the buffer layer and determining whether the buffer layer has achieved a desired thickness.
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