Invention Grant
- Patent Title: Multi-function miniaturized surface-mount device and process for producing the same
- Patent Title (中): 多功能小型化表面贴装装置及其制造方法
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Application No.: US15018896Application Date: 2016-02-09
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Publication No.: US09443825B2Publication Date: 2016-09-13
- Inventor: Ching-Hohn Lien , Xing-Xiang Huang , Hsing-Tsai Huang , Jie-An Zhu , Hong-Zong Xu , Yi-Wei Chen , Jung-Chun Chiang
- Applicant: SFI Electronics Technology Inc.
- Applicant Address: TW Taoyuan
- Assignee: SFI ELECTRONICS TECHNOLOGY INC.
- Current Assignee: SFI ELECTRONICS TECHNOLOGY INC.
- Current Assignee Address: TW Taoyuan
- Agency: Bacon & Thomas, PLLC
- Priority: TW104105626A 20150217
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/48 ; H01L25/065 ; H01L25/00
Abstract:
A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.
Public/Granted literature
- US20160240510A1 MULTI-FUNCTION MINIATURIZED SURFACE-MOUNT DEVICE AND PROCESS FOR PRODUCING THE SAME Public/Granted day:2016-08-18
Information query
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