公开(公告)号：US09165872B2

公开(公告)日：2015-10-20

申请号：US14523066

申请日：2014-10-24

申请人： SFI Electronics Technology Inc.

发明人： Ching-Hohn Lien ,  Xing-Xiang Huang ,  Hsing-Tsai Huang ,  Hong-Zong Xu

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L21/44 ,  H01L21/48 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/00015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/48

摘要： A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.

摘要翻译： 由于不含外部引脚引脚的新颖的芯片尺寸二极管封装小型化，像芯片尺寸外观，以提高尺寸精度，使得二极管封装由自动化设备适当地生产以获得自动批量生产; 所生成的二极管封装可以包含一个或多个二极管芯片，以增加在应用中更有用的通用功能，例如作为SMT二极管封装或阵列型SMT二极管制造的，以及由于不含含铅材料制成的本二极管封装 符合环保要求。

公开(公告)号：US09947444B1

公开(公告)日：2018-04-17

申请号：US15709606

申请日：2017-09-20

申请人： SFI Electronics Technology Inc.

发明人： Ching-Hohn Lien ,  Jie-An Zhu ,  Zhi-Xian Xu ,  Ting-Yi Fang ,  Hong-Zong Xu

IPC分类号： H01C7/10 ,  H01C17/06 ,  H01C7/102 ,  H01C17/28 ,  H01C1/14

CPC分类号： H01C17/06 ,  H01C1/14 ,  H01C7/1006 ,  H01C7/102 ,  H01C7/112 ,  H01C7/18 ,  H01C17/065 ,  H01C17/06546 ,  H01C17/281

摘要： A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).

公开(公告)号：US09443825B2

公开(公告)日：2016-09-13

申请号：US15018896

申请日：2016-02-09

申请人： SFI Electronics Technology Inc.

发明人： Ching-Hohn Lien ,  Xing-Xiang Huang ,  Hsing-Tsai Huang ,  Jie-An Zhu ,  Hong-Zong Xu ,  Yi-Wei Chen ,  Jung-Chun Chiang

IPC分类号： H01L21/48 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2924/186 ,  H01L2224/83 ,  H01L2924/00014

摘要： A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.

摘要翻译： 表面安装器件（SMD）不使用常规的引线框架，并且包含由单个管芯或两个或更多个串联，并联或串联和并联的任何组合电连接的模具形成的多功能模具模块， 与现有技术相比，提供这样的SMD具有一个或多个不同的功能，包括波滤波，整流，浪涌保护，感测，限流，电压调节或防止电压回流，所公开的SMD由较少的部件形成，更简单 制造更有效地减少布线长度和噪声。

公开(公告)号：US09691736B2

公开(公告)日：2017-06-27

申请号：US14881558

申请日：2015-10-13

申请人： SFI Electronics Technology Inc.

发明人： Ching-Hohn Lien ,  Xing-Xiang Huang ,  Hsing-Tsai Huang ,  Hong-Zong Xu ,  Yi-Wei Chen

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/02 ,  H01L23/15 ,  H01L23/31 ,  H01L29/861 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L25/065

CPC分类号： H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

摘要： A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

公开(公告)号：US09691735B2

公开(公告)日：2017-06-27

申请号：US14585857

申请日：2014-12-30

申请人： SFI Electronics Technology Inc.

发明人： Ching-Hohn Lien ,  Xing-Xiang Huang ,  Hsing-Tsai Huang ,  Hong-Zong Xu ,  Yi-Wei Chen

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/02 ,  H01L23/15 ,  H01L23/31 ,  H01L29/861 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L25/065

CPC分类号： H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

摘要： A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.