Invention Grant
- Patent Title: Thin-layer encapsulation for an optoelectronic component, method for the production thereof, and optoelectronic component
- Patent Title (中): 用于光电子部件的薄层封装，其制造方法和光电子部件
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Application No.: US13260560Application Date: 2010-03-22
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Publication No.: US09444062B2Publication Date: 2016-09-13
- Inventor: Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
- Applicant: Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agent Cozen O'Connor
- Priority: DE102009014543 20090324; DE102009024411 20090609
- International Application: PCT/EP2010/053717 WO 20100322
- International Announcement: WO2010/108894 WO 20100930
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L51/44 ; H01L51/52
Abstract:
A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.
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