Invention Grant
- Patent Title: Semiconductor device and high-frequency module
- Patent Title (中): 半导体器件和高频模块
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Application No.: US14361448Application Date: 2012-11-26
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Publication No.: US09444512B2Publication Date: 2016-09-13
- Inventor: Eigo Tange , Shigeki Koya , Yasushi Shigeno , Akishige Nakajima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2011-269731 20111209
- International Application: PCT/JP2012/080488 WO 20121126
- International Announcement: WO2013/084739 WO 20130613
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04B1/525 ; H04B1/00 ; H04B15/04 ; H04B1/44

Abstract:
Reduction of intermodulation distortion in a high-frequency switch is achieved. A semiconductor device (1) includes an antenna terminal (ANT_LB), plural external terminals (RX_LB, TX_LB, TRX_LB, TERM_LB), plural first high-frequency switches (101 to 104), and plural control terminals. Each first high-frequency switch includes plural first field-effect transistors, plural first resistors (Rg_1 to Rg_6) connected to the gate terminals of the first field-effect transistors, and a second resistor (Rc) disposed between the corresponding control terminal and the first resistors. The second resistor in the first high-frequency switch disposed between the first terminal supplied with an RF transmission signal and an RF reception signal of a frequency division duplex system and the antenna terminal is configured so that linearity of current-voltage characteristics thereof is higher than linearity of current-voltage characteristics of the first resistor.
Public/Granted literature
- US20140328223A1 SEMICONDUCTOR DEVICE AND HIGH-FREQUENCY MODULE Public/Granted day:2014-11-06
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