Invention Grant
US09447932B2 Light-emitting diode package and method of manufacturing the same 有权
发光二极管封装及其制造方法

Light-emitting diode package and method of manufacturing the same
Abstract:
A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.
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