Invention Grant
- Patent Title: Light-emitting diode package and method of manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US14306127Application Date: 2014-06-16
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Publication No.: US09447932B2Publication Date: 2016-09-20
- Inventor: Jae Sul An , Seok Hyun Nam , Sang Hyuck Yoon , Yeong Bae Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2014-0013127 20140205
- Main IPC: H01L33/00
- IPC: H01L33/00 ; F21K99/00 ; H01L33/44 ; H01L33/50 ; H01L33/64

Abstract:
A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.
Public/Granted literature
- US20150219288A1 LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-08-06
Information query
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