Invention Grant
US09449137B2 Buffered conduits for high throughput channel implementation, crosstalk de-sensitization and late timing fixes on skew sensitive buses
有权
用于高吞吐量通道实现的缓冲管道，对于偏斜敏感总线的串扰消除敏感和延迟定时
- Patent Title: Buffered conduits for high throughput channel implementation, crosstalk de-sensitization and late timing fixes on skew sensitive buses
- Patent Title (中): 用于高吞吐量通道实现的缓冲管道，对于偏斜敏感总线的串扰消除敏感和延迟定时
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Application No.: US14028811Application Date: 2013-09-17
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Publication No.: US09449137B2Publication Date: 2016-09-20
- Inventor: Raashid Moin Shaikh , Vishnuraj Arukat Rajan
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Robert D. Marshall, Jr.; Frank D. Cimino
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F17/50 ; G06F13/40
Abstract:
A method of manufacturing a system on a chip and a system on a chip including a set of pre-designed modules. These modules are place on a semiconductor and connecting by a set of busses formed according to a set of design rules specifying tracks having a minimum size of conductors and a minimum spacing between conductors. The busses are routed in a preferred direction. The busses include minimum size conductors at alternate tracks within a selected metal layer of the semiconductor and minimum size conductors at alternate tracks in a different metal layer. The conductors in the different metal layer are connected to corresponding connectors in the selected metal layer by vias. Shields of conductors not connected to the bus may be included in tracks not including bus conductors.
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