Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US14317099Application Date: 2014-06-27
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Publication No.: US09449650B2Publication Date: 2016-09-20
- Inventor: Jong-hyun Seok , Do-hyung Kim , Won-hyung Song , Young-ho Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0114689 20130926
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G11C5/04 ; G11C7/02 ; G11C7/10
Abstract:
A memory module that includes: a printed circuit board having a connecting terminal; memory chips arranged on the printed circuit board; data buffers disposed on a first surface of the printed circuit board and corresponding to the memory chips; and resistance units disposed on a second surface of the printed circuit board and corresponding to the data buffers.
Public/Granted literature
- US20150016047A1 MEMORY MODULE Public/Granted day:2015-01-15
Information query
