公开(公告)号：US09449650B2

公开(公告)日：2016-09-20

申请号：US14317099

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun Seok ,  Do-hyung Kim ,  Won-hyung Song ,  Young-ho Lee

IPC: H05K7/00 ,  G11C5/04 ,  G11C7/02 ,  G11C7/10

CPC classification number: G11C5/04 ,  G11C7/02 ,  G11C7/10 ,  G11C2207/105

Abstract: A memory module that includes: a printed circuit board having a connecting terminal; memory chips arranged on the printed circuit board; data buffers disposed on a first surface of the printed circuit board and corresponding to the memory chips; and resistance units disposed on a second surface of the printed circuit board and corresponding to the data buffers.

Abstract translation: 一种存储模块，包括：具有连接端子的印刷电路板; 存储芯片布置在印刷电路板上; 数据缓冲器，布置在印刷电路板的第一表面上并对应于存储器芯片; 和布置在印刷电路板的第二表面上并对应于数据缓冲器的电阻单元。

公开(公告)号：US09793034B2

公开(公告)日：2017-10-17

申请号：US14625983

申请日：2015-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun Seok

IPC: H01C13/02 ,  G11C5/04 ,  H05K1/11 ,  G11C11/401 ,  G11C7/10 ,  H05K3/34

CPC classification number: H01C13/02 ,  G11C5/04 ,  G11C7/10 ,  G11C11/401 ,  H05K1/117 ,  H05K3/3415 ,  H05K2201/0385 ,  H05K2201/09545 ,  H05K2201/10159

Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.

公开(公告)号：US20150016047A1

公开(公告)日：2015-01-15

申请号：US14317099

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun Seok ,  Do-hyung Kim ,  Won-hyung Song ,  Young-ho Lee

IPC: G06F1/18

CPC classification number: G11C5/04 ,  G11C7/02 ,  G11C7/10 ,  G11C2207/105

Abstract: A memory module that includes: a printed circuit board having a connecting terminal; memory chips arranged on the printed circuit board; data buffers disposed on a first surface of the printed circuit board and corresponding to the memory chips; and resistance units disposed on a second surface of the printed circuit board and corresponding to the data buffers.

Abstract translation: 一种存储模块，包括：具有连接端子的印刷电路板; 存储芯片布置在印刷电路板上; 数据缓冲器，布置在印刷电路板的第一表面上并对应于存储器芯片; 和布置在印刷电路板的第二表面上并对应于数据缓冲器的电阻单元。