Methods of forming features having differing pitch spacing and critical dimensions are disclosed herein. One method includes forming an underlying layer of material above a semiconductor substrate. The method further includes forming a masking layer above the underlying layer of material. The masking layer includes features positioned above a first region of the substrate and features positioned above a second region of the substrate. The features have different pitch spacing and critical dimensions. The method further includes performing at least one etching process on the underlying layer of material through the masking layer.