Invention Grant
- Patent Title: Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method
- Patent Title (中): 包括具有简化散热的三维一体化结构的装置和相应的制造方法
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Application No.: US14590404Application Date: 2015-01-06
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Publication No.: US09449896B2Publication Date: 2016-09-20
- Inventor: Sandrine Lhostis , Olga Kokshagina , Yann Beilliard , Vincent Fiori
- Applicant: STMICROELECTRONICS SA , STMICROELECTRONICS (CROLLES 2) SAS
- Applicant Address: FR Montrouge FR Crolles
- Assignee: STMICROELECTRONICS SA,STMICROELECTRONICS (CROLLES 2) SAS
- Current Assignee: STMICROELECTRONICS SA,STMICROELECTRONICS (CROLLES 2) SAS
- Current Assignee Address: FR Montrouge FR Crolles
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: FR1450230 20140113
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/473 ; H01L21/56 ; H01L25/065 ; H01L23/00 ; H01L25/18
Abstract:
A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.
Public/Granted literature
Information query
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