公开(公告)号：US09418954B2

公开(公告)日：2016-08-16

申请号：US14659680

申请日：2015-03-17

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Pierre Bar ,  Alisee Taluy ,  Olga Kokshagina

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/3213 ,  H01L21/56 ,  H01L21/768 ,  H01L23/36 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76897 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14519 ,  H01L2224/29013 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/3015 ,  H01L2224/30519 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.

Abstract translation: 一种装置包括组装在插入器上的芯片。 电绝缘层在芯片周围涂覆插入件的上表面。 第一金属线在插入件的上表面上延伸并且布置在与芯片连接的导电元件之间。 每个第一金属线的端部被布置成延伸超过芯片在插入件上的投影。 导热通孔将第一金属线的端部连接到支撑在设备的上表面处的散热器。

公开(公告)号：US09953895B2

公开(公告)日：2018-04-24

申请号：US14643837

申请日：2015-03-10

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Pascal Ancey ,  Simon Gousseau ,  Olga Kokshagina

IPC: H01L21/768 ,  H01L23/34 ,  H01L23/48 ,  H05K7/20 ,  F28D15/04 ,  H01L23/427 ,  H01L23/473 ,  H01L21/48 ,  H01L21/3205 ,  H01L21/3065 ,  H01L21/02 ,  H01L23/367 ,  F28D15/02

CPC classification number: H01L23/427 ,  F28D15/04 ,  F28D15/046 ,  F28D2015/0225 ,  H01L21/02164 ,  H01L21/30655 ,  H01L21/32051 ,  H01L21/32056 ,  H01L21/4803 ,  H01L23/367 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.

公开(公告)号：US20180076114A1

公开(公告)日：2018-03-15

申请号：US15816990

申请日：2017-11-17

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Pascal Ancey ,  Simon Gousseau ,  Olga Kokshagina

IPC: H01L23/427 ,  H01L21/3205 ,  F28D15/04 ,  H01L23/473 ,  H01L23/367 ,  H01L21/48 ,  H01L21/3065 ,  H01L21/02 ,  F28D15/02

CPC classification number: H01L23/427 ,  F28D15/04 ,  F28D15/046 ,  F28D2015/0225 ,  H01L21/02164 ,  H01L21/30655 ,  H01L21/32051 ,  H01L21/32056 ,  H01L21/4803 ,  H01L23/367 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.

公开(公告)号：US09615443B2

公开(公告)日：2017-04-04

申请号：US14487758

申请日：2014-09-16

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Stephane Monfray ,  Sandrine Lhostis ,  Christophe Maitre ,  Olga Kokshagina ,  Philippe Coronel

IPC: F28F27/00 ,  H05K1/02 ,  F28D9/00 ,  F28F27/02 ,  H01L23/473

CPC classification number: H05K1/0203 ,  F28D9/0062 ,  F28F27/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.

公开(公告)号：US20160173003A1

公开(公告)日：2016-06-16

申请号：US14903994

申请日：2014-08-18

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS SA ,  COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Stephane Monfray ,  Christophe Maitre ,  Olga Kokshagina ,  Thomas Skotnicki ,  Ulrich Soupremanien

IPC: H02N1/08

CPC classification number: H02N1/08 ,  B81B3/0021 ,  B81B3/0024 ,  B81B2203/053 ,  F01K5/02 ,  H02N1/006

Abstract: A power conversion device includes an enclosure containing one or more drops of a liquid. A capacitive electret transducer is coupled to the enclosure. In response to applied heat at a heating surface, the liquid vaporizes and then condenses on a flexible membrane of the capacitive electret transducer. The flexible membrane is displaced in response to the vaporization-condensation and the capacitive electret transducer generates an output current.

Abstract translation: 电力转换装置包括包含一滴或多滴液体的外壳。 电容驻极体换能器耦合到外壳。 响应于加热表面处的加热，液体蒸发然后在电容驻极体换能器的柔性膜上冷凝。 柔性膜响应于汽化冷凝而移位，并且电容驻极体换能器产生输出电流。

公开(公告)号：US20150270192A1

公开(公告)日：2015-09-24

申请号：US14659680

申请日：2015-03-17

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Pierre Bar ,  Alisee Taluy ,  Olga Kokshagina

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L21/768 ,  H01L21/48 ,  H01L21/3213 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76897 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14519 ,  H01L2224/29013 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/3015 ,  H01L2224/30519 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.

Abstract translation: 一种装置包括组装在插入器上的芯片。 电绝缘层在芯片周围涂覆插入件的上表面。 第一金属线在插入件的上表面上延伸并且布置在与芯片连接的导电元件之间。 每个第一金属线的端部被布置成延伸超过芯片在插入件上的投影。 导热通孔将第一金属线的端部连接到支撑在设备的上表面处的散热器。

公开(公告)号：US20160322276A1

公开(公告)日：2016-11-03

申请号：US15204488

申请日：2016-07-07

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Pierre Bar ,  Alisee Taluy ,  Olga Kokshagina

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76897 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/14131 ,  H01L2224/14519 ,  H01L2224/29013 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/3015 ,  H01L2224/30519 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

Abstract: A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.

公开(公告)号：US20150262908A1

公开(公告)日：2015-09-17

申请号：US14643837

申请日：2015-03-10

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Pascal Ancey ,  Simon Gousseau ,  Olga Kokshagina

IPC: H01L23/427 ,  H01L21/48 ,  F28D15/04 ,  H01L21/3065 ,  H01L21/02 ,  H01L23/367 ,  H01L23/473 ,  H01L21/3205

CPC classification number: H01L23/427 ,  F28D15/04 ,  F28D15/046 ,  F28D2015/0225 ,  H01L21/02164 ,  H01L21/30655 ,  H01L21/32051 ,  H01L21/32056 ,  H01L21/4803 ,  H01L23/367 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.

Abstract translation: 一种制造热管的方法，包括以下步骤：在基板上形成圆柱形开口，所述圆柱形开口设置有围绕所述开口的中心轴线径向延伸的多个环状凹部; 在凹部中排列分离由催化碳纳米管生长的材料制成的环形条; 以及在所述环形条的开口中生长碳纳米管。

公开(公告)号：US20150200151A1

公开(公告)日：2015-07-16

申请号：US14590404

申请日：2015-01-06

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Sandrine LHOSTIS ,  Olga Kokshagina ,  Yann Beilliard ,  Vincent Fiori

IPC: H01L23/473 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/473 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.

Abstract translation: 一种装置包括支撑件，支撑件上方的三维集成结构以及围绕结构设置的侧向封装区域。 横向封装区域包括被配置为使得循环冷却流体成为可能的第一通道。

公开(公告)号：US10298151B2

公开(公告)日：2019-05-21

申请号：US14903994

申请日：2014-08-18

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat a l'Energie Atomique et aux Energies Alternatives

Inventor： Stephane Monfray ,  Christophe Maitre ,  Olga Kokshagina ,  Thomas Skotnicki ,  Ulrich Soupremanien

IPC: H02N1/08 ,  H02N2/18 ,  H01L41/113 ,  B81B3/00 ,  H02N1/00 ,  F01K5/02 ,  H02N1/06 ,  H01L41/08

Abstract: A power conversion device includes an enclosure containing one or more drops of a liquid. A capacitive electret transducer is coupled to the enclosure. In response to applied heat at a heating surface, the liquid vaporizes and then condenses on a flexible membrane of the capacitive electret transducer. The flexible membrane is displaced in response to the vaporization-condensation and the capacitive electret transducer generates an output current.