公开(公告)号：US20170092678A1

公开(公告)日：2017-03-30

申请号：US15280544

申请日：2016-09-29

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Michel Marty ,  Salim Boutami ,  Sandrine Lhostis

IPC: H01L27/146 ,  G02B5/20 ,  H01L21/311

CPC classification number: H01L27/14625 ,  B82Y20/00 ,  G02B5/008 ,  G02B5/201 ,  G02B5/204 ,  G02B2207/101 ,  G02F1/133509 ,  G02F1/133516 ,  H01L21/311 ,  H01L27/14621 ,  H01L27/14685

Abstract: A spectral filter is manufactured using a process wherein a first rectangular bar is formed within a first layer made of a first material, said first rectangular bar being made of a second material having a different optical index. The process further includes, in a second layer over the first layer, a second rectangular bar made of the second material. The second rectangular bar is positioned in contact with the first rectangular bar. The second layer is also made of the first material.

公开(公告)号：US20140210071A1

公开(公告)日：2014-07-31

申请号：US14155007

申请日：2014-01-14

Applicant: Anne Lombardot ,  STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA

Inventor： Laurent-Luc Chapelon ,  Pascal Ancey ,  Sandrine Lhostis

IPC: H01L23/36

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/481 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589

Abstract: An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.

Abstract translation: 集成结构包括支撑至少一个芯片的支撑件和附接到芯片的散热壳体。 壳体是导热的并具有与芯片兼容的热膨胀。 壳体还可以包括填充有相变材料的封闭空腔。

公开(公告)号：US09810823B2

公开(公告)日：2017-11-07

申请号：US15357871

申请日：2016-11-21

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Sandrine Lhostis ,  Salim Boutami

IPC: H01Q15/02 ,  G02B5/20 ,  H01L27/146

CPC classification number: G02B5/208 ,  G02B5/20 ,  G02B5/204 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14645 ,  H01L27/14649

Abstract: An infrared high-pass plasmonic filter includes a copper layer interposed between two layers of a dielectric material. An array of patterned openings extend through the copper layer and are filled with the dielectric material. Each patterned opening is in the shape of a greek cross, with the arms of adjacent patterns being collinear. A ratio of the width to the length of each arm is in the range from 0.3 to 0.6, and the distance separating the opposite ends of arms of adjacent patterns is shorter than 10 nm.

公开(公告)号：US09615443B2

公开(公告)日：2017-04-04

申请号：US14487758

申请日：2014-09-16

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Stephane Monfray ,  Sandrine Lhostis ,  Christophe Maitre ,  Olga Kokshagina ,  Philippe Coronel

IPC: F28F27/00 ,  H05K1/02 ,  F28D9/00 ,  F28F27/02 ,  H01L23/473

CPC classification number: H05K1/0203 ,  F28D9/0062 ,  F28F27/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.

公开(公告)号：US09520334B2

公开(公告)日：2016-12-13

申请号：US14155007

申请日：2014-01-14

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  Anne Lombardot

Inventor： Laurent-Luc Chapelon ,  Pascal Ancey ,  Sandrine Lhostis

IPC: H01L23/34 ,  H01L23/36 ,  H01L23/427 ,  H01L23/433 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L29/06

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/481 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589

Abstract: An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.

Abstract translation: 集成结构包括支撑至少一个芯片的支撑件和附接到芯片的散热壳体。 壳体是导热的并具有与芯片兼容的热膨胀。 壳体还可以包括填充有相变材料的封闭空腔。

公开(公告)号：US09171973B2

公开(公告)日：2015-10-27

申请号：US14559006

申请日：2014-12-03

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat a l'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Sandrine Lhostis ,  Salim Boutami ,  Michel Marty

IPC: H01L31/0232 ,  H01L31/0216 ,  G02B5/20 ,  H01L27/146

CPC classification number: H01L31/02162 ,  G02B5/203 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02165 ,  H01L31/02327

Abstract: An integrated imaging device supports front face illumination with one or more photosensitive regions formed in a substrate. A lower dielectric region is provided over the substrate, the lower dielectric region having an upper face. A metal optical filter having a metal pattern is provided on the upper face (or extending into the lower dielectric region from the upper face). An upper dielectric region is provided on top of the lower dielectric region and metal optical filter. The lower dielectric region is at least part of a pre-metal dielectric layer, and the upper dielectric region is at least part of a metallization layer.

Abstract translation: 集成成像装置支持在基板中形成的一个或多个感光区域的前面照明。 下部电介质区域设置在衬底上，下部电介质区域具有上表面。 具有金属图案的金属滤光器设置在上表面（或从上表面延伸到下介电区域中）。 在下部电介质区域和金属光学滤波器的顶部设置有上部电介质区域。 下电介质区域是预金属介电层的至少一部分，并且上电介质区域是金属化层的至少一部分。

公开(公告)号：US10014337B2

公开(公告)日：2018-07-03

申请号：US15280544

申请日：2016-09-29

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Michel Marty ,  Salim Boutami ,  Sandrine Lhostis

IPC: H01L21/311 ,  H01L27/146 ,  G02B5/20 ,  G02F1/1335 ,  G02B5/00 ,  B82Y20/00

CPC classification number: H01L27/14625 ,  B82Y20/00 ,  G02B5/008 ,  G02B5/201 ,  G02B5/204 ,  G02B2207/101 ,  G02F1/133509 ,  G02F1/133516 ,  H01L21/311 ,  H01L27/14621 ,  H01L27/14685

Abstract: A spectral filter is manufactured using a process wherein a first rectangular bar is formed within a first layer made of a first material, said first rectangular bar being made of a second material having a different optical index. The process further includes, in a second layer over the first layer, a second rectangular bar made of the second material. The second rectangular bar is positioned in contact with the first rectangular bar. The second layer is also made of the first material.

公开(公告)号：US20150155319A1

公开(公告)日：2015-06-04

申请号：US14559006

申请日：2014-12-03

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Sandrine Lhostis ,  Salim Boutami ,  Michel Marty

IPC: H01L27/146

CPC classification number: H01L31/02162 ,  G02B5/203 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02165 ,  H01L31/02327

Abstract: An integrated imaging device supports front face illumination with one or more photosensitive regions formed in a substrate. A lower dielectric region is provided over the substrate, the lower dielectric region having an upper face. A metal optical filter having a metal pattern is provided on the upper face (or extending into the lower dielectric region from the upper face). An upper dielectric region is provided on top of the lower dielectric region and metal optical filter. The lower dielectric region is at least part of a pre-metal dielectric layer, and the upper dielectric region is at least part of a metallization layer.

Abstract translation: 集成成像装置支持在基板中形成的一个或多个感光区域的前面照明。 下部电介质区域设置在衬底上，下部电介质区域具有上表面。 具有金属图案的金属滤光器设置在上表面（或从上表面延伸到下介电区域中）。 在下部电介质区域和金属光学滤波器的顶部设置有上部电介质区域。 下电介质区域是预金属介电层的至少一部分，并且上电介质区域是金属化层的至少一部分。

公开(公告)号：US20170153367A1

公开(公告)日：2017-06-01

申请号：US15357871

申请日：2016-11-21

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Sandrine Lhostis ,  Salim Boutami

IPC: G02B5/20 ,  H01L27/146

CPC classification number: G02B5/208 ,  G02B5/20 ,  G02B5/204 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14645 ,  H01L27/14649

Abstract: An infrared high-pass plasmonic filter includes a copper layer interposed between two layers of a dielectric material. An array of patterned openings extend through the copper layer and are filled with the dielectric material. Each patterned opening is in the shape of a greek cross, with the arms of adjacent patterns being collinear. A ratio of the width to the length of each arm is in the range from 0.3 to 0.6, and the distance separating the opposite ends of arms of adjacent patterns is shorter than 10 nm.

公开(公告)号：US09449896B2

公开(公告)日：2016-09-20

申请号：US14590404

申请日：2015-01-06

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Sandrine Lhostis ,  Olga Kokshagina ,  Yann Beilliard ,  Vincent Fiori

IPC: H01L23/31 ,  H01L23/473 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L23/473 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.

Abstract translation: 一种装置包括支撑件，支撑件上方的三维集成结构以及围绕结构设置的侧向封装区域。 横向封装区域包括被配置为使得循环冷却流体成为可能的第一通道。