Invention Grant
- Patent Title: Packaging device and method of making the same
- Patent Title (中): 包装装置及其制作方法
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Application No.: US13434256Application Date: 2012-03-29
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Publication No.: US09449933B2Publication Date: 2016-09-20
- Inventor: Chang-Chia Huang , Tsung-Shu Lin , Ming-Da Cheng , Wen-Hsiung Lu , Bor-Rung Su
- Applicant: Chang-Chia Huang , Tsung-Shu Lin , Ming-Da Cheng , Wen-Hsiung Lu , Bor-Rung Su
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/482 ; H01L23/00 ; H01L23/498
Abstract:
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace.
Public/Granted literature
- US20130256870A1 PACKAGING DEVICE AND METHOD OF MAKING THE SAME Public/Granted day:2013-10-03
Information query
IPC分类:
