Invention Grant
- Patent Title: Support module and robot having the same
- Patent Title (中): 支持模块和机器人具有相同的功能
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Application No.: US13723534Application Date: 2012-12-21
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Publication No.: US09452797B2Publication Date: 2016-09-27
- Inventor: Joo Hyung Kim , Kyung Shik Roh , Kee Hong Seo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0141530 20111223
- Main IPC: B62D57/02
- IPC: B62D57/02 ; B25J9/00 ; B25J15/00 ; B62D57/032
Abstract:
A support module includes a first rigid body, a space formation body connected to the first rigid body and forming an enclosed space, and a plurality of hard particles located within the enclosed space. When at least a predetermined pressure is applied to the support module such that a volume of the enclosed space is decreased to a predetermined value, the plurality of hard particles and space formation body form a second rigid body. Such a support module may improve the stability of a walking robot, the grip of a gripping structure, or the stability of a load-bearing structure.
Public/Granted literature
- US20130162015A1 SUPPORT MODULE AND ROBOT HAVING THE SAME Public/Granted day:2013-06-27
Information query
IPC分类:
