Invention Grant
- Patent Title: Conformal thin film deposition of electropositive metal alloy films
- Patent Title (中): 正电薄膜沉积正电金属合金薄膜
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Application No.: US14140042Application Date: 2013-12-24
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Publication No.: US09455150B2Publication Date: 2016-09-27
- Inventor: Scott B. Clendenning , Patricio E. Romero , Gilbert Dewey
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Grossman, Tucker, Perrault & Pfleger, PLLC
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/78 ; H01L29/66 ; H01L29/45 ; H01L29/49 ; H01L29/06 ; H01L29/51

Abstract:
The present disclosure relates to a method of forming a semiconductor. The method includes heating a substrate in a reaction chamber, supplying to the reaction chamber a first constituent including a metal borohydride wherein the metal borohydride includes at least one of: an alkaline earth metal, a transition metal, or a combination thereof; supplying to the reaction chamber a main-group hydride constituent; and depositing a metal compound on the substrate, wherein the metal compound comprises a) at least one of an alkaline earth metal a transition metal or a combination thereof, b) boron and c) optionally the main group alloying element.
Public/Granted literature
- US20150179798A1 CONFORMAL THIN FILM DEPOSITION OF ELECTROPOSITIVE METAL ALLOY FILMS Public/Granted day:2015-06-25
Information query
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