Invention Grant
- Patent Title: Bowl-shaped solder structure
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Application No.: US14754293Application Date: 2015-06-29
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Publication No.: US09455237B2Publication Date: 2016-09-27
- Inventor: Cyprian Emeka Uzoh , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L23/498 ; H01L21/768 ; H01L21/48 ; H01L21/3213

Abstract:
An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.
Public/Granted literature
- US20150303157A1 Bowl-shaped solder structure Public/Granted day:2015-10-22
Information query
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