Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US14323684Application Date: 2014-07-03
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Publication No.: US09455382B2Publication Date: 2016-09-27
- Inventor: Daisuke Iwakura
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-141326 20130705
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/56

Abstract:
A light emitting device comprising: a package having a recess; a light emitting element mounted in the recess of the package; a transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; a first fluorescent material contained in the transmissive member; and a second fluorescent material contained in the sealing resin and having a specific gravity different from that of the first fluorescent material, wherein a greater amount of the second fluorescent material is distributed to a side of the light emitting element than above the light emitting element, and a side surface of the light emitting element is exposed on the sealing resin.
Public/Granted literature
- US20150008464A1 LIGHT EMITTING DEVICE Public/Granted day:2015-01-08
Information query
IPC分类: