Invention Grant
- Patent Title: System on chip and temperature control method thereof
- Patent Title (中): 片上系统及其温度控制方法
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Application No.: US13948691Application Date: 2013-07-23
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Publication No.: US09459680B2Publication Date: 2016-10-04
- Inventor: Hyungock Kim , Wook Kim , Jun Seomun , Chungki Oh , JaeHan Jeon , Kyungtae Do , JungYun Choi , Hyosig Won , Kee Sup Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0081855 20120726
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G05D23/19 ; G06F1/20

Abstract:
A temperature control method of a semiconductor device is provided. The temperature control method includes detecting a temperature of the semiconductor device; activating a reverse body biasing operation in which a body bias voltage applied to a function block of the semiconductor device is regulated, when the detected temperature is greater than a first temperature level; and activating a thermal throttling operation in which at least one of a frequency of a driving clock provided to a function block of the semiconductor device and a driving voltage applied to the function block of the semiconductor device is regulated, when the detected temperature is greater than a second temperature level that is different than the first temperature level.
Public/Granted literature
- US20140032949A1 SYSTEM ON CHIP AND TEMPERATURE CONTROL METHOD THEREOF Public/Granted day:2014-01-30
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