Disclosed is an antenna for inter-chip wireless power transmission in a 3D-wireless chip package, wherein the 3D-wireless chip package includes: a first chip transmitting AC power through a transmitting antenna; and a plurality of second chips sequentially stacked on or under the first chip and receiving the AC power from the first chip through receiving antennas, respectively, and the receiving antennas are individually formed on the second chips, respectively, and positioned without vertically overlapping each other over or under the transmitting antenna.