Invention Grant
- Patent Title: Multi-layer memory array and manufacturing method of the same
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Application No.: US14948482Application Date: 2015-11-23
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Publication No.: US09461064B2Publication Date: 2016-10-04
- Inventor: Teng-Hao Yeh , Chih-Wei Hu , Yen-Hao Shih
- Applicant: Macronix International Co., Ltd
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L27/115 ; H01L21/02 ; H01L21/28 ; H01L29/51

Abstract:
A memory array includes a plurality of ridge-shaped multi-layer stacks extending along a first direction, and a hard mask layer formed on top of the plurality of ridge-shaped multi-layer stacks. The hard mask layer includes a plurality of stripes vertically aligned with the plurality of ridge-shaped multi-layer stacks, respectively, a plurality of bridges connecting adjacent ones of the stripes along a second direction orthogonal to the first direction, and a plurality of hard mask through holes between the plurality of bridges and the plurality of stripes.
Public/Granted literature
- US20160086971A1 MULTI-LAYER MEMORY ARRAY AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2016-03-24
Information query
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