Invention Grant
- Patent Title: Grounded radial diode pack
- Patent Title (中): 接地径向二极管封装
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Application No.: US14147205Application Date: 2014-01-03
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Publication No.: US09461526B2Publication Date: 2016-10-04
- Inventor: Gregory Alan Rittmeyer , David S. Behling , Timothy R. Welch
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US NC Charlotte
- Agency: Snell & Wilmer LLP
- Main IPC: H02K11/00
- IPC: H02K11/00 ; H02K11/04 ; H02K9/19

Abstract:
The present disclosure relates to generators and their components. Specifically, a grounded radial diode pack is disclosed herein. A design to accommodate safe dissipation static charge build-up is disclosed. Safe dissipation of accumulated charge involves the provision of a suitable electrical path that will allow charges to flow to ground.
Public/Granted literature
- US20150194863A1 GROUNDED RADIAL DIODE PACK Public/Granted day:2015-07-09
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