发明授权
US09462698B2 Metallized substrate, metal paste composition, and method for manufacturing metallized substrate
有权
金属化基板，金属糊料组合物和金属化基板的制造方法
- 专利标题： Metallized substrate, metal paste composition, and method for manufacturing metallized substrate
- 专利标题（中）： 金属化基板，金属糊料组合物和金属化基板的制造方法
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申请号： US13993463申请日： 2011-12-02
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公开(公告)号： US09462698B2公开(公告)日： 2016-10-04
- 发明人: Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
- 申请人： Naoto Takahashi , Yasuyuki Yamamoto , Emi Ushioda
- 申请人地址： JP Shunan-shi, Yamaguchi
- 专利权人： TOKUYAMA CORPORATION
- 当前专利权人： TOKUYAMA CORPORATION
- 当前专利权人地址： JP Shunan-shi, Yamaguchi
- 代理机构： Ladas & Parry LLP
- 优先权： JP2010291626 20101228
- 国际申请： PCT/JP2011/077969 WO 20111202
- 国际公布： WO2012/090647 WO 20120705
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K3/06 ; H05K3/10 ; H05K3/38 ; H05K1/03
摘要：
The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (10); a titanium nitride layer (20) on the sintered substrate (10); an adhesion layer (30) on the titanium nitride layer (20); and a copper plating layer (40) on or above the adhesion layer (30), wherein the adhesion layer (30) contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.
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