Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).