Laser systems and methods for internally marking thin layers, and articles produced thereby
    1.
    发明授权
    Laser systems and methods for internally marking thin layers, and articles produced thereby 有权
    用于内部标记薄层的激光系统和方法,以及由此制造的制品

    公开(公告)号:US09463528B2

    公开(公告)日:2016-10-11

    申请号:US14461171

    申请日:2014-08-15

    Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

    Abstract translation: 激光输出(114)用于标记包括由衬底(102)支撑的层(104)的制品(100),其中该层(104)的厚度(t)小于或等于50微米。 在束腰(90)的焦点(80)处将激光输出(114)聚焦到小于或等于5微米的数值孔径衍射限制光斑尺寸(32)并被引导到层(104)中, 以形成在层(104)内并且在制品(100)的区域内包括多个激光诱发的裂纹的多个结构,其中激光诱发的裂纹终止于层(104)内而不延伸到基底 102)或所述层(104)的外表面(108),并且其中所述多个结构被配置为散射入射在所述物品(100)上的光。

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