Invention Grant
US09463551B2 Polishing pad with porous interface and solid core, and related apparatus and methods
有权
具有多孔界面和实芯的抛光垫及相关设备和方法
- Patent Title: Polishing pad with porous interface and solid core, and related apparatus and methods
- Patent Title (中): 具有多孔界面和实芯的抛光垫及相关设备和方法
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Application No.: US14459452Application Date: 2014-08-14
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Publication No.: US09463551B2Publication Date: 2016-10-11
- Inventor: Robert Vacassy , George Fotou
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Arlene Hornilla; Salim A. Hasan
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/22 ; B24B37/04 ; C08J9/00 ; H01L21/306 ; C08J9/12
Abstract:
Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.
Public/Granted literature
- US20150056892A1 POLISHING PAD WITH POROUS INTERFACE AND SOLID CORE, AND RELATED APPARATUS AND METHODS Public/Granted day:2015-02-26
Information query
