Abstract:
The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.
Abstract:
Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.