Invention Grant
- Patent Title: Apparatus for uniform pumping within a substrate process chamber
- Patent Title (中): 用于在衬底处理室内均匀泵送的装置
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Application No.: US13871671Application Date: 2013-04-26
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Publication No.: US09464732B2Publication Date: 2016-10-11
- Inventor: Paul Benjamin Reuter , Martin Jeffrey Salinas , Jared Ahmad Lee , Imad Yousif
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: C23C16/00
- IPC: C23C16/00 ; F16L3/00 ; H01L21/67 ; H01L21/687

Abstract:
Substrate supports for use in process chambers having limited physical space for configuring chamber components are disclosed. In some embodiments, a substrate support may include a body having a support surface; a utilities feed coupled to the body and comprising a second portion coupled to and extending laterally away from the body beyond a diameter of the body, and first portion coupled to the second portion and extending perpendicularly away from the body; and a cover plate movably disposable beneath and with respect to the body between a first position disposed completely beneath the body, and a second position wherein the cover plate is disposed over the first portion of the utilities feed and includes a first portion disposed beneath the body, and wherein the first portion has a curved edge having a radius equal to the distance from a central axis of the support surface to the curved edge.
Public/Granted literature
- US20130284287A1 APPARATUS FOR UNIFORM PUMPING WITHIN A SUBSTRATE PROCESS CHAMBER Public/Granted day:2013-10-31
Information query
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