Invention Grant
- Patent Title: Ion implantation apparatus
- Patent Title (中): 离子注入装置
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Application No.: US14096735Application Date: 2013-12-04
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Publication No.: US09466467B2Publication Date: 2016-10-11
- Inventor: Mitsuaki Kabasawa , Kazuhiro Watanabe , Hitoshi Ando , Kouji Inada , Tatsuya Yamada
- Applicant: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2012-265844 20121204
- Main IPC: H01J37/00
- IPC: H01J37/00 ; H01J37/32 ; H01J37/30 ; H01J37/317

Abstract:
An ion implantation apparatus includes: a plurality of units for accelerating an ion beam generated in an ion source; and a plurality of units for adjusting a scan beam and implanting ions into a wafer. A horizontal U-shaped folder type beamline having opposite long straight portions includes the plurality of units for adjusting the scan beam in a long straight portion to have substantially the same length as the ion source and the plurality of units for accelerating the ion beam.
Public/Granted literature
- US20140150723A1 ION IMPLANTATION APPARATUS Public/Granted day:2014-06-05
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