An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced.In an electrostatic chuck device 1 provided with an electrostatic chuck section 2 which has a placement plate 11, an upper surface 11a of which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plate 12 integrated with the placement plate 11, and an internal electrode for electrostatic adsorption 13 and an insulating material layer 14 which are provided between the placement plate 11 and the support plate 12, an annular projection portion 21 is provided at a peripheral border portion on the upper surface 11a, a plurality of projection portions 22 having the same height as the height of the annular projection portion 21 are provided in an area surrounded by the annular projection portion 21 of the upper surface 11a, and an upper end portion of the annular projection portion 21 and an upper end portion of each of the plurality of projection portions 22 are located on a concave surface 23 with a central portion of the upper surface 11a as a basal plane.