Invention Grant
US09466532B2 Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
有权
具有通孔的微电子机械系统（MEMS）结构通孔及其形成方法
- Patent Title: Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
- Patent Title (中): 具有通孔的微电子机械系统（MEMS）结构通孔及其形成方法
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Application No.: US13429029Application Date: 2012-03-23
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Publication No.: US09466532B2Publication Date: 2016-10-11
- Inventor: Chia-Hua Chu , Kuei-Sung Chang , Te-Hao Lee
- Applicant: Chia-Hua Chu , Kuei-Sung Chang , Te-Hao Lee
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; B81C1/00 ; B82Y30/00
Abstract:
The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high processing temperatures, which enables more complete removal of chemical species from the dielectric materials in the substrates prior to sealing cavities of the MEMS structures. Fusion bonding of MEMS structures reduces outgassing of chemical species and is compatible with the cavity formation process. The MEMS structures bonded by fusion bonding are mechanically stronger compared to eutectic bonding due to a higher bonding ratio. In addition, fusion bonding enables the formation of through substrate vias (TSVs) in the MEMS structures.
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