Invention Grant
- Patent Title: Electroplating apparatus with membrane tube shield
- Patent Title (中): 电镀设备带膜管屏蔽
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Application No.: US14601989Application Date: 2015-01-21
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Publication No.: US09469911B2Publication Date: 2016-10-18
- Inventor: Paul R. McHugh , Gregory J. Wilson , Roey Shaviv
- Applicant: APPLIED Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED Materials, Inc.
- Current Assignee: APPLIED Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Perkins Coie LLP
- Agent Kenneth H. Ohriner
- Main IPC: C25D5/00
- IPC: C25D5/00
Abstract:
An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.
Public/Granted literature
- US20160208402A1 ELECTROPLATING APPARATUS WITH MEMBRANE TUBE SHIELD Public/Granted day:2016-07-21
Information query
