Invention Grant
US09472539B2 Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
有权
半导体芯片和具有包括半导体芯片的包装封装（POP）结构的半导体封装
- Patent Title: Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
- Patent Title (中): 半导体芯片和具有包括半导体芯片的包装封装（POP）结构的半导体封装
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Application No.: US14992174Application Date: 2016-01-11
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Publication No.: US09472539B2Publication Date: 2016-10-18
- Inventor: Yong-Hoon Kim , Hyo-Soon Kang , Hee-Seok Lee , Jang-Ho Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0047698 20130429
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/18 ; H01L23/50 ; H01L23/498 ; H01L25/065 ; H01L25/10 ; G11C5/02 ; H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.
Public/Granted literature
Information query
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