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1.发明申请SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP 审中-公开半导体芯片和具有包装（POP）结构的封装的半导体封装，包括半导体芯片公开(公告)号：US20160126229A1
公开(公告)日：2016-05-05
申请号：US14992174
申请日：2016-01-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong-Hoon Kim , Hyo-Soon Kang , Hee-Seok Lee , Jang-Ho Cho
IPC: H01L25/18 , H01L23/50 , H01L23/31 , H01L25/065 , H01L23/00
CPC classification number: H01L25/18 , G11C5/025 , H01L21/563 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L24/17 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.
Abstract translation: 一种半导体芯片，包括衬底，布置在衬底上的第一数据焊盘和布置在衬底上的第一控制/寻址焊盘，其中第一数据焊盘布置在衬底的边缘区域中，并且第一控制/地址焊盘 布置在基板的中心区域中。
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2.发明授权Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip 有权半导体芯片和具有包括半导体芯片的包装封装（POP）结构的半导体封装公开(公告)号：US09472539B2
公开(公告)日：2016-10-18
申请号：US14992174
申请日：2016-01-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong-Hoon Kim , Hyo-Soon Kang , Hee-Seok Lee , Jang-Ho Cho
IPC: H01L23/48 , H01L25/18 , H01L23/50 , H01L23/498 , H01L25/065 , H01L25/10 , G11C5/02 , H01L23/00 , H01L21/56 , H01L23/31
CPC classification number: H01L25/18 , G11C5/025 , H01L21/563 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L24/17 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.
Abstract translation: 一种半导体芯片，包括衬底，布置在衬底上的第一数据焊盘和布置在衬底上的第一控制/寻址焊盘，其中第一数据焊盘布置在衬底的边缘区域中，并且第一控制/地址焊盘 布置在基板的中心区域中。
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