发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US14837565申请日: 2015-08-27
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公开(公告)号: US09472656B2公开(公告)日: 2016-10-18
- 发明人: Shunpei Yamazaki , Atsuo Isobe , Yoshinori Ieda , Masaharu Nagai
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office
- 代理商 Eric J. Robinson
- 优先权: JP2011-264973 20111202; JP2011-265036 20111202; JP2011-265158 20111202; JP2011-283789 20111226
- 主分类号: H01L21/84
- IPC分类号: H01L21/84 ; H01L29/66 ; H01L29/786 ; H01L29/417
摘要:
A semiconductor device including a minute transistor with a short channel length is provided. A gate insulating layer is formed over a gate electrode layer; an oxide semiconductor layer is formed over the gate insulating layer; a first conductive layer and a second conductive layer are formed over the oxide semiconductor layer; a conductive film is formed over the first conductive layer and the second conductive layer; a resist mask is formed over the conductive film by performing electron beam exposure; and then a third conductive layer and a fourth conductive layer are formed over and in contact with the first conductive layer and the second conductive layer, respectively, by selectively etching the conductive film.
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