发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US14655658申请日: 2013-12-25
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公开(公告)号: US09472688B2公开(公告)日: 2016-10-18
- 发明人: Masatoshi Aketa , Mineo Miura
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JP2012-282882 20121226
- 国际申请: PCT/JP2013/084678 WO 20131225
- 国际公布: WO2014/104100 WO 20140703
- 主分类号: H01L29/872
- IPC分类号: H01L29/872 ; H01L29/861 ; H01L29/66 ; H01L29/06 ; H01L29/16 ; H01L29/20 ; H01L29/36 ; H01L29/24
摘要:
A semiconductor device according to the present invention includes a semiconductor layer, a trench formed selectively in an obverse surface portion of the semiconductor layer and defining a unit cell of predetermined shape in the obverse surface portion, a second conductivity type layer formed to conform to a portion or an entirety of an inner surface of the trench, an obverse surface layer of a first conductivity type formed so as to be exposed from an obverse surface of the semiconductor layer in the unit cell, a reverse surface layer of the first conductivity type formed so as to be exposed from a reverse surface of the semiconductor layer, a drift layer of the first conductivity type formed between the obverse surface layer and the reverse surface layer of the semiconductor layer and being of lower concentration than the obverse surface layer and the reverse surface layer, a first electrode contacting the obverse surface layer and forming an ohmic contact with the obverse surface layer, and a second electrode contacting the reverse surface layer and forming an ohmic contact with the reverse surface layer.
公开/授权文献
- US20160005884A1 SEMICONDUCTOR DEVICE 公开/授权日:2016-01-07
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