Invention Grant
- Patent Title: Thermal management system
- Patent Title (中): 热管理系统
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Application No.: US14570204Application Date: 2014-12-15
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Publication No.: US09476651B2Publication Date: 2016-10-25
- Inventor: Naveenan Thiagarajan , Hendrik Pieter Jacobus de Bock , William Dwight Gerstler
- Applicant: General Electric Company
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Paul J. DiConza
- Main IPC: H01M10/052
- IPC: H01M10/052 ; F28D15/02 ; H01M10/659

Abstract:
A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.
Public/Granted literature
- US20160169591A1 THERMAL MANAGEMENT SYSTEM Public/Granted day:2016-06-16
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