Invention Grant
US09478314B2 Memory utilizing bundle-level status values and bundle status circuits
有权
内存利用捆绑级状态值和捆绑状态电路
- Patent Title: Memory utilizing bundle-level status values and bundle status circuits
- Patent Title (中): 内存利用捆绑级状态值和捆绑状态电路
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Application No.: US14486963Application Date: 2014-09-15
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Publication No.: US09478314B2Publication Date: 2016-10-25
- Inventor: Hungwei Lu , Wei-An Lai , Shuo-Nan Hung , Chi Lo
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Yiding Wu
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C29/42 ; G11C29/44 ; G11C29/52 ; G11C16/00 ; G11C29/04

Abstract:
An integrated circuit memory includes a memory array, including a plurality of data lines. A buffer structure is coupled to the plurality of data lines, including a plurality of storage elements to store bit-level status values for the plurality of data lines. The memory includes logic to indicate bundle-level status values of corresponding bundles of storage elements in the buffer structure based on the bit-level status values of bits in the corresponding bundles. A plurality of bundle status circuits is arranged in a daisy chain and coupled to respective bundles in the buffer structure, producing an output of the daisy chain indicating detection of a bundle in the first status. Control circuitry executes cycles to determine the output of the daisy chain, each cycle clearing a bundle status circuit indicating the first status if the output indicates detection of a bundle in the first status in the cycle.
Public/Granted literature
- US20160077153A1 MEMORY UTILIZING BUNDLE-LEVEL STATUS VALUES AND BUNDLE STATUS CIRCUITS Public/Granted day:2016-03-17
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