A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.