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US09479138B2 Microelectromechanical systems device package and method for producing the microelectromechanical systems device package 有权
微机电系统器件封装和生产微机电系统器件封装的方法

  • Patent Title: Microelectromechanical systems device package and method for producing the microelectromechanical systems device package
  • Patent Title (中): 微机电系统器件封装和生产微机电系统器件封装的方法
  • Application No.: US14784351
    Application Date: 2013-05-24
  • Publication No.: US09479138B2
    Publication Date: 2016-10-25
  • Inventor: Gilles Moulard
  • Applicant: EPCOS AG
  • Applicant Address: DE Munich
  • Assignee: EPCOS AG
  • Current Assignee: EPCOS AG
  • Current Assignee Address: DE Munich
  • Agency: Slater Matsil, LLP
  • International Application: PCT/EP2013/060776 WO 20130524
  • International Announcement: WO2014/187505 WO 20141127
  • Main IPC: H01L29/82
  • IPC: H01L29/82 ;  H03H9/02 ;  B81B7/00 ;  B81C1/00
Microelectromechanical systems device package and method for producing the microelectromechanical systems device package
Abstract:
A microelectromechanical systems device package includes a MEMS device mounted in flip-chip technology on a substrate. A film of non-evaporable getter material is disposed between the substrate and the MEMS device. A cover structure encapsulates the MEMS device. This invention further provides a method for manufacturing the microelectromechanical systems device package.
Abstract(Chinese):

微机电系统器件封装包括以衬底上的倒装芯片技术安装的MEMS器件。 非可蒸发吸气材料的薄膜设置在基板和MEMS装置之间。 封装结构封装了MEMS器件。 本发明还提供一种用于制造微机电系统器件封装的方法。

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