A memory module is disclosed. The memory module may have an enclosure having a slot in a wall of the enclosure. The memory module may also have a device disposed within the enclosure. The memory module may further have a thermal cutoff disposed in the slot. The thermal cutoff may have a first end attached to the device. The thermal cutoff may also have a second end attached to a wire configured to electrically connect to the device. The thermal cutoff may disconnect the wire from the device when subjected to a threshold temperature.