Invention Grant
- Patent Title: Solid-state image pickup device, method of manufacturing thereof, and electronic apparatus
- Patent Title (中): 固态图像拾取装置，其制造方法和电子装置
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Application No.: US14855775Application Date: 2015-09-16
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Publication No.: US09484383B2Publication Date: 2016-11-01
- Inventor: Yukihiro Kiyota , Keiji Mabuchi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2010-068879 20100324
- Main IPC: H04N5/76
- IPC: H04N5/76 ; H01L27/146 ; H04N5/369 ; H04N5/378
Abstract:
Provided is a solid-state image pickup device including: a plurality of pixels, each of which includes a photoelectric conversion portion and a pixel transistor formed in a front surface side of a substrate, wherein a rear surface side of the substrate is set as a light receiving plane of the photoelectric conversion portion; and an element, which becomes a passive element or an active element, which is disposed in the front surface side of the substrate so as to be superimposed on the photoelectric conversion portion.
Public/Granted literature
- US20160005784A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2016-01-07
Information query
