A printed board arranged within an upper case and having a hole, a partition portion arranged within the upper case so as to be substantially orthogonal to the printed board and provided with a cut, and a temperature sensor arranged within the upper case and having a covered wire, a soldered portion provided at an end of the covered wire, and a temperature detection portion provided at another end of the covered wire, are provided. The temperature sensor is fixed such that the soldered portion is soldered to a surface of the printed board, the covered wire is inserted through the hole and engaged with the cut to be fixed, and the temperature detection portion is located near an inner surface of the upper case.