Invention Grant
- Patent Title: Managing sideband segments in on-die system fabric
- Patent Title (中): 管理片上系统架构中的边带片段
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Application No.: US13631870Application Date: 2012-09-29
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Publication No.: US09489028B2Publication Date: 2016-11-08
- Inventor: Hai Ming Khor , Kay Keat Khoo , Vui Yong Liew , Bhushan Vaidya
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Priority: MYPI2011004721 20110930
- Main IPC: H04L12/24
- IPC: H04L12/24 ; G06F1/32 ; G06F15/78

Abstract:
Methods and apparatus for managing sideband segments in an On-Die System Fabric (OSF) are described. In one embodiment, a sideband OSF includes a plurality of segments that may be reset or powered down independently after power management logic determines that in progress messages have been handled and future messages to the segment being reset or powered down will be blocked. Other embodiments are also disclosed.
Public/Granted literature
- US20130086398A1 MANAGING SIDEBAND SEGMENTS IN ON-DIE SYSTEM FABRIC Public/Granted day:2013-04-04
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