Invention Grant
- Patent Title: Folded memory modules
- Patent Title (中): 折叠内存模块
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Application No.: US14182986Application Date: 2014-02-18
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Publication No.: US09489323B2Publication Date: 2016-11-08
- Inventor: Amir Amirkhany , Suresh Rajan , Ravindranath Kollipara , Ian Shaeffer , David A. Secker
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Fenwick & West LLP
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F12/00 ; G06F13/16 ; G06F13/40

Abstract:
A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.
Public/Granted literature
- US20140237152A1 Folded Memory Modules Public/Granted day:2014-08-21
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