Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14750303Application Date: 2015-06-25
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Publication No.: US09490258B2Publication Date: 2016-11-08
- Inventor: Soo-Yeon Jeong , Dong-gu Yi , Tae-Jong Lee , Jae-Po Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP.
- Priority: KR10-2014-0117063 20140903
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/11 ; H01L29/40 ; H01L29/08

Abstract:
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device comprises a first fin type active pattern formed on a substrate and extending in a first direction and including first to third parts. At least one dimension of the third part measuring less than the corresponding dimension of the first part. A gate electrode extending in a second direction different from the first direction is at least partially formed on the first part of the fin type active pattern. A first source/drain is formed on the third part of the fin type active pattern.
Public/Granted literature
- US20160064387A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-03-03
Information query
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