Invention Grant
- Patent Title: Methods for bonding substrates using liquid adhesive
- Patent Title (中): 使用液体粘合剂粘合基材的方法
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Application No.: US14183224Application Date: 2014-02-18
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Publication No.: US09494178B2Publication Date: 2016-11-15
- Inventor: Cyrus Y. Liu , Kuo-Hua Sung , Po-Jui Chen , Silvio Grespan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H05K5/06
- IPC: H05K5/06 ; F16B11/00 ; C09J5/00 ; B32B5/26 ; B32B7/12

Abstract:
Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.
Public/Granted literature
- US20140246148A1 Methods for Bonding Substrates Using Liquid Adhesive Public/Granted day:2014-09-04
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