Invention Grant
US09496154B2 Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias
有权
在微电子部件中使用底部填充胶带，以及具有与通过衬底通孔耦合的腔的微电子部件
- Patent Title: Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias
- Patent Title (中): 在微电子部件中使用底部填充胶带，以及具有与通过衬底通孔耦合的腔的微电子部件
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Application No.: US14488187Application Date: 2014-09-16
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Publication No.: US09496154B2Publication Date: 2016-11-15
- Inventor: Eric S. Tosaya , Rajesh Katkar , Liang Wang , Cyprian Emeka Uzoh
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L23/31 ; H01L25/065 ; H01L25/00
Abstract:
A microelectronic component (110, 120) has a contact pad (110C, 120C, 920C) recessed in a cavity (410) and covered by underfill tape (130). The cavity has a void (410V) below the underfill tape. A protruding contact pad of another microelectronic component ruptures the underfill tape to enter the cavity and bond to the recessed contact pad. The void helps in rupturing the underfill tape, thus reducing the amount of underfill residue between the two contact pads and improving the contact resistance. Also provided is a microelectronic component having a substrate with a cavity and having a through-substrate via extending into the cavity. Other features are also provided.
Public/Granted literature
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