Invention Grant
- Patent Title: Printed circuit board and printed circuit board for camera module
- Patent Title (中): 印刷电路板和相机模块用印刷电路板
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Application No.: US14464362Application Date: 2014-08-20
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Publication No.: US09496594B2Publication Date: 2016-11-15
- Inventor: Dae Hyun Park , Han Kim , Seong Hee Choi , Mi Ja Han
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0062412 20140523
- Main IPC: H01P5/19
- IPC: H01P5/19 ; H03H7/38 ; H01P3/08 ; H01L23/64 ; H05K1/02
Abstract:
A printed circuit board includes a signal transmitting part and a ground part disposed having an insulating layer therebetween. The ground part includes an impedance adjusting part.
Public/Granted literature
- US20150340753A1 PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD FOR CAMERA MODULE Public/Granted day:2015-11-26
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